Advantages and disadvantages of SMD COB GOB package
With the development of the LED display industry, various packaging processes have emerged. From the previous DIP process to the surface mount (SMD) process, COB packaging technology, GOB packaging technology, many LED manufacturers have made every effort to achieve better results during the development of small-field production processes. Solutions for small screen displays.
SMD screen (Surface Mount Technology) packaged LED products are made from lamp beads with different specifications and then soldered to the circuit board by high-temperature high-speed reflow soldering using a high-speed chip monitor to make display units with different pitches. Small-pitch SMD products usually expose the LED lamp beads before masking. It also has a large share in the LED application market due to its mature and stable technologies, low production costs, good heat dissipation, and simple maintenance.
- Low level of protection
It does not have moisture-proof, waterproof, dust-proof, shockproof, or anti-collision features. In humid climates, lots of dead light and bad light tend to appear. During transportation, the led light is easy to falls and get damaged; the dead light phenomenon is easily caused by the influence of static electricity.
- It is very painful to the eyes
Long-term viewing may cause glare and fatigue. Additionally, it has a “blue damage” effect. Due to the short wavelength and high frequency of blue LEDs, the human retina is prone to lesions when exposed to blue light for a long time.
- LED lamp life is short
Environmental factors will greatly shorten the life of the lamp. Due to environmental factors, copper ions migrate on the PCB circuit board and micro short circuit phenomenon may occur.
- Mask problems
The mask used by the small-pitch SMD LED module expands easily in a high-temperature environment, affecting the imaging effect. Moreover, after using the LED screen for a period of time, the mask cannot be cleaned and may cause whitening or yellowing. Affects the imaging effect.
COB
The full name of COB packaging technology is “Chips on Board”, which is a technology that solves the LED heat dissipation problem. Compared with online and SMD, it has ways of saving space, simplifying the packaging process and effective thermal management. COB has certain advantages in terms of manufacturing efficiency, low thermal resistance, light quality, application and cost. However, as a new technology, the accumulation of COB in the small-field LED industry is insufficient, and the process needs to be improved, and the main products on the market have disadvantages such as high cost.
- Poor color consistency “Since no light source is selected, color cannot be separated from color, and consistency is poor.
- Poor surface flatness “Because there is a single lamp distribution, the flatness is poor and the touch is obvious.
- “Hard to maintain” due to the need for professional equipment, maintenance is difficult and the maintenance cost is high. Generally, it must be returned to the factory for maintenance.
- High production cost” due to high defect rate, production cost is much higher than SMD small pitch.
GOB (Board on board) packaging technology is to solve the protection problem of LED lights. It uses advanced new transparent materials to package the substrate and LED packaging unit to provide effective protection. This material not only has super high transparency but also super thermal conductivity. GOB’s small pitch can adapt to any harsh environment.
GOB P2.5 indoor full-color led
Compared with the traditional outdoor SMD screen process, it has the characteristics of protection, moisture resistance, water resistance, anti-collision, and UV resistance. Can be used in more severe environments to prevent large-scale dead lights and extinguishing; Compared with the COB process, it has simpler maintenance, lower maintenance costs and a broader perspective. COB lamps can solve problems such as inability to mix, severe modularity, poor spectral separation and poor surface flatness. But because it uses the entire surface of the glue, the picture is often not clear.